Snapdragon 845 features: Latest Qualcomm chip to get better Improvements

Qualcomm next-gen flagship processor Snapdragon 845 for the year 2018 is out. The company has announced it at the Snapdragon Technology Summit held at Hawaii. Qualcomm claims that the new Snapdragon 845 features offer a better overall smartphone performance. Also, Xiaomi has confirmed that the next flagship devices in 2018 will likely to feature Snapdragon 845.

Qualcomm claims an increase of performance by 25 percent in the new Snapdragon 845 chipset when compared to Snapdragon 835. On the other hand, it is also believed that the new chipset will provide 30 percent better battery life than its predecessor. Qualcomm Snapdragon 845 happens to be the first mobile platform to come with ‘Secure Processing Unit’ a physically separate processor for more secured biometrics scans. Hence, there are quite some differences between the two processors.

List of Snapdragon 845 features to take place in the Qualcomm latest chipset:

Processor update:

New Snapdragon 845 flaunts an upgraded Adreno 630 GPU and a Semi-custom ARM Cortex – Kryo 385 architecture. On the other hand, the latest Cortex A75 and A55 CPU designs power by Arm’s DynamIQ technology. The 2 MB of shared L3 cache feature in the DynamIQ will improve task and memory sharing capabilities among different core types in the shared cluster. Cortex A75 clocks up to 2.8 GHz and it pairing with A55 is efficient to reach 1.7 GHz.

Camera and Connectivity:

Qualcomm has provided propriety Spectra 280 Image Signal Processor (ISP) in the Snapdragon 845 to deliver better and faster image processing. Which, it can capture up to 16-megapixel resolution at 60 images per second. Also, the ISP supports ultra-high definition video capture.

Besides that, Snapdragon X20 LTE modem which comes onboard facilitates the much anticipated Gigabit LTE connectivity. The chipset maker says that the modem will provide 20 percent faster performance when compared to its older X16 LTE. Also, this includes 802.11ad multi-gigabit Wi-Fi and integrated 2×2 802.11ac for much faster connectivity.

Artificial Intelligent Improvements:

New Snapdragon 845 features set it ready for the Artificial Intelligence improvements. Speaking about the tasks like recognizing and categorizing images will get all the privilege. Qualcomm’s third-generation Hexagon 685 Digital Signal Processor (DSP) powers the AI module for a high-end and complicated data processing. The chip also helps to deliver an enhanced camera, voice and gaming experiences.

Qualcomm has made it ready for the machine learning applications like image recognition, it also includes behind-the-scenes improvements. For Instance, the chip assists the user with not registering fingerprints when it taps while gripping the sides of an edge-to-edge display.

Battery Life and AR, VR functions:

An all-day lasting battery is the much-needed aspect of every present-day Smartphone user. Making improvements over its predecessor, the maker focused to serve it on Snapdragon 845 Mobile Platform. On the other hand, the Quick Charge 4+ technology enables a device to gain 50 percent battery in only 15 minutes.

The new upgrade from Qualcomm is aiming at virtual and augmented reality headsets. The “Adreno foveation” feature will help to deliver a better VR quality.

Considering the fact that Snapdragon 845 is a top-end chipset and we can expect it only on flagship devices at first. Buzz is that Samsung’s next premium offering Galaxy S9 may host Qualcomm Snapdragon 845 processor. However,

Xiaomi has confirmed that its upcoming flagship Mi 7, will run the high-end chip. Chinese giant OnePlus has also announced the same for its next release.